Copper formate with CAS number 544 - 19 - 4 is an inorganic compound. Its chemical formula is Cu(HCOO)₂. It usually appears as a blue - green crystalline solid. The molar mass of copper formate is approximately 153.59 g/mol. This product is provided by our factory at the best price, ensuring high - quality and stable supply. In terms of solubility, it is soluble in water and some polar solvents. The purity of our factory - supplied copper formate can reach a high level, meeting the strict requirements of various industrial and laboratory applications.
1. **Catalyst**: Copper formate can serve as a catalyst in many chemical reactions. For example, in some organic synthesis reactions, it can accelerate the reaction rate and improve the selectivity of the reaction products. It is widely used in the synthesis of fine chemicals, such as the preparation of certain esters and aldehydes.
2. **Electroplating**: In the electroplating industry, copper formate can be used as a source of copper ions. It can be used to deposit a copper layer on the surface of various substrates, improving the conductivity, corrosion resistance, and appearance of the substrates.
3. **Agriculture**: It can be used as a trace element fertilizer. Copper is an essential trace element for plants, and copper formate can provide a stable source of copper for plants, promoting plant growth and development, and enhancing the resistance of plants to diseases and pests.
1. **In Chemical Reactions**: When using copper formate as a catalyst, first, accurately weigh the required amount of copper formate according to the reaction formula and experimental requirements. Then, add it to the reaction system under appropriate reaction conditions, such as temperature, pressure, and reaction time. Stir the reaction mixture evenly to ensure full contact between the catalyst and the reactants.
2. **In Electroplating**: Prepare the electroplating solution by dissolving copper formate in a suitable solvent, usually water, and add some auxiliary agents to adjust the properties of the electroplating solution, such as pH value, conductivity, etc. Place the substrate to be electroplated in the electroplating solution, and connect it to the negative electrode of the power supply, while the positive electrode is connected to a copper anode. Adjust the current density and electroplating time according to the requirements of the electroplating layer thickness and quality.
3. **As a Fertilizer**: Dilute copper formate with water according to the recommended concentration, and then spray it on the leaves of plants or apply it to the soil. Pay attention to the dosage and frequency of use to avoid excessive copper accumulation in plants and soil, which may cause harm to plants and the environment.
1. **Chemical Synthesis Case**: A chemical research institute was synthesizing a new type of organic compound. By using copper formate as a catalyst, the reaction time was significantly reduced from the original 5 hours to 2 hours, and the yield of the target product increased from 60% to 80%. The researchers found that copper formate could effectively activate the reactants and promote the progress of the reaction.
2. **Electroplating Case**: An electroplating factory used copper formate in the electroplating process of electronic components. Compared with the traditional copper - plating process, the electroplating layer obtained by using copper formate was more uniform and dense, with better adhesion and conductivity. The rejection rate of the electroplated products was reduced from 10% to 3%, greatly improving the production efficiency and product quality.
3. **Agriculture Case**: A farm applied copper formate as a fertilizer to apple orchards. After a period of time, the growth of apple trees was significantly improved. The leaves became greener and more lush, and the number of apples per tree increased by about 15%. At the same time, the incidence of apple diseases, such as apple scab, was reduced by about 20%.
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